JPS62178543U - - Google Patents
Info
- Publication number
- JPS62178543U JPS62178543U JP6664286U JP6664286U JPS62178543U JP S62178543 U JPS62178543 U JP S62178543U JP 6664286 U JP6664286 U JP 6664286U JP 6664286 U JP6664286 U JP 6664286U JP S62178543 U JPS62178543 U JP S62178543U
- Authority
- JP
- Japan
- Prior art keywords
- island
- protrusion
- preform material
- semiconductor
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6664286U JPS62178543U (en]) | 1986-04-30 | 1986-04-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6664286U JPS62178543U (en]) | 1986-04-30 | 1986-04-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62178543U true JPS62178543U (en]) | 1987-11-12 |
Family
ID=30904838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6664286U Pending JPS62178543U (en]) | 1986-04-30 | 1986-04-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62178543U (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023166740A (ja) * | 2022-05-10 | 2023-11-22 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53115175A (en) * | 1977-03-18 | 1978-10-07 | Toshiba Corp | Semiconductor device |
| JPS5596666A (en) * | 1979-01-18 | 1980-07-23 | Mitsubishi Electric Corp | Method of fabricating semiconductor device substrate |
| JPS57128052A (en) * | 1981-02-02 | 1982-08-09 | Hitachi Ltd | Semiconductor device |
| JPS5910249A (ja) * | 1982-07-09 | 1984-01-19 | Nec Corp | 半導体装置用リ−ドフレ−ム |
-
1986
- 1986-04-30 JP JP6664286U patent/JPS62178543U/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53115175A (en) * | 1977-03-18 | 1978-10-07 | Toshiba Corp | Semiconductor device |
| JPS5596666A (en) * | 1979-01-18 | 1980-07-23 | Mitsubishi Electric Corp | Method of fabricating semiconductor device substrate |
| JPS57128052A (en) * | 1981-02-02 | 1982-08-09 | Hitachi Ltd | Semiconductor device |
| JPS5910249A (ja) * | 1982-07-09 | 1984-01-19 | Nec Corp | 半導体装置用リ−ドフレ−ム |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023166740A (ja) * | 2022-05-10 | 2023-11-22 | ルネサスエレクトロニクス株式会社 | 半導体装置 |